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MediaTek launches Dimensity 7200 chipset in its new Dimensity 7000 series.
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The Dimensity 7200 chipset provides AI imaging features, gaming optimizations, and 5G speeds with power savings.
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It utilizes the TSMC 4nm second-generation process found in the Dimensity 9200 and is ideal for ultra-slim designs.
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The chipset has an octa-core CPU with Cortex-A715 and Cortex-A510 cores for peak performance in every app.
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The built-in AI Processing Unit (APU) maximizes the efficiency of AI tasks and AI-fusion processing for optimized power and performance.
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The MediaTek HyperEngine 5.0 technology delivers AI-based Variable Rate Shading (VRS) for power savings and CPU and GPU smart resource optimization for better battery life for gamers.
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The chipset integrates a powerful Arm Mali G610 GPU that supports fast response times and sustains high frame rates for smooth gameplay.
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It supports 200MP main cameras for epic photography and enables impressive video capturing with 4K HDR video.
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The chipset has a 3GPP Release-16 standard Sub-6GHz 5G modem with up to 4.7Gbps downlink, triband Wi-Fi 6E connectivity, and next-gen Bluetooth 5.3.
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The Dual SIM capability allows users to have two connections, making it easy to take work and personal calls from a single smartphone.